Science popularization: One second to read electronic component encapsulation

Encapsulation refers to the circuit pin on the silicon chip, with a wire connection to the external junction, in order to connect with other devices; encapsulation form refers to the housing used to install semiconductor integrated circuit chips.

It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connects to the pins of the package shell with wires through the contacts on the chip, and these pins are connected to other devices through the wires on the printed circuit board, so as to realize the connection between the internal chip and the external circuit.

Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance to decline. On the other hand, the packaged chip is also easier to install and transport.

Universal circuit has organized several types of common packages of electronic components for everyone, remember to collect!

1. Chip resistance/chip capacitance:

The trade of components in the industry often says that 0805, 0201 packaging, for the new white and astronomical figures.

In fact, the packaging of resistance capacitors is simply their size. In the case of 0805, the package size of the SMD patch element is the surface mount device of the imperial 0805, that is, the metric 2012, indicating that the component length = 2 mm wide = 1.2 mm.

SMD patch components package size types:

Metric system：3216——2012——1608——1005——0603——0402；
British system：1206——0805——0603——0402——0201——01005。

Since the early days of surface assembly technology, the trend has been towards smaller and smaller passive and active components. The main driver of widgets is portable products (cellular phones, laptop computers, PDAs, etc.). We now have the smallest passive component package, the 01005 package.

2. patch diode:

Name, dimensions and pad spacing, other package names of similar dimensions

SMC， 6.8X6-8.0

SMB， 4.5X3.5-5.3

SMA， 4.5X2.5-5.0， SOD-106

SOD-123， 2.7X1.6-3.5， SC-77A

SOD-323， 1.7X1.2-2.5， SC-76/SC-90A

SOD-523， 1.2X0.8-1.6， SC-79

SOD-723， 1.0X0.6-1.4

SOD-923， 0.8X0.6-1.0

3.Chip triode:

Name, dimensions and pad spacing, other package names of similar dimensions

D2PAK， 10X8.8-2.54， LDPAK

DPAK， 6.5X5.5-2.3， SC-63

SOT-223，6.5X3.5-2.3， SC-73

SOT-89， 4.5X2.5-1.5， TO-243/SC-62/UPAK/MPT3

SOT-23， 2.9X1.5-2.0， SC-59A/SOT-346/MPAK/SMT3

SOT-323，2.0X1.2-1.3， SC-70/CMPAK/UMT3

SOT-523，1.6X0.8-1.0， SC-75A/EMT3

SOT-623，1.4X0.8-0.9， SC-89/MFPAK

SOT-723， 1.2X0.8-0.8

SOT-923， 1.2X0.8-0.8， VMT3

4.IC Chips/Integrated Circuits:

1.SOP/SOIC encapsulation

SOP is the abbreviation of English Small Outline Package, that is, small outline package. SOP packaging technology was developed by Phillip Company in 1968 ~ 1969. Later, it gradually derived SOJ (J-pin small shape package), TSOP (thin small shape package), VSOP (very small shape package), SSOP (reduced type SOP), TSSOP (thin reduced type SOP), SOT (small shape transistor), SOIC (small shape integrated circuit) and so on.

2、DIP encapsulation

DIP is the abbreviation of English Double In-line Package, that is, double in-line package. One of the plug-in type packages, the pins lead from both sides of the package, and the packaging material is plastic and ceramic. DIP is the most popular plug-in package, the application range includes standard logic ics, memory LSI, microcomputer circuits and so on.

3、PLCC encapsulation

PLCC is the abbreviation of the English Plastic Leaded Chip Carrier, that is, the plastic sealed J-lead chip package. PLCC package, square shape, 32-pin package, there are pins on all sides, the shape size is much smaller than DIP package. PLCC package is suitable for SMT surface mount technology to install wiring on the PCB, with the advantages of small size and high reliability.

4、TQFP encapsulation

TQFP is the abbreviation of the English Thin Quad Flat Package, that is, the thin plastic seal four corner flat package. The four-sided Flat package (TQFP) process makes efficient use of space, thereby reducing the space requirements for printed circuit boards. Due to the reduced height and volume, this packaging process is ideal for space-demanding applications such as PCMCIA cards and networking devices. Almost all of ALTERA's CPLDS/FPGas come in TQFP packages.

5、PQFP encapsulation

PQFP is the abbreviation of the English Plastic Quad Flat Package, that is, the plastic sealing square flat package. PQFP package chip pin distance is very small, the pin is very thin, generally large-scale or very large scale integrated circuit using this form of packaging, the number of pins is generally more than 100.

6、TSOP encapsulation

TSOP is the abbreviation of English Thin Small Outline Package, that is, thin small size package. A typical feature of TSOP memory packaging technology is to make pins around the package chip, and TSOP is suitable for using SMT technology (surface mount technology) to install wiring on the PCB (printed circuit board). TSOP package size, the parasitic parameter (current changes greatly, resulting in output voltage disturbance) is reduced, suitable for high-frequency applications, easy to operate, and relatively high reliability.

7、BGA encapsulation

BGA is the abbreviation of the English Ball Grid Array Package, that is, the ball grid array package. With the progress of technology in the 1990s, chip integration continued to improve, the number of I/O pins increased sharply, power consumption also increased, and the requirements for integrated circuit packaging were more stringent. In order to meet the needs of development, BGA packaging began to be used in production.

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